Earbud Housing Parting-Line Height Difference
Fine parting lines on curved housing surfaces are difficult to quantify reliably with 2D imaging, making it challenging to measure actual height variations across the seam.
PCBA Component Height Inspection
Dense component layouts with subtle height variations are difficult to assess manually. 2D imaging cannot directly quantify component height or tilt with sufficient accuracy.
Precision Connector Inspection
Small contacts with tight spacing and reflective surfaces require simultaneous inspection of profile, position, and height deviations.
PIN Height Inspection
Pins are tiny and densely arranged; pin height, coplanarity, and tilt differences affect connector assembly quality directly.
Product Features
Design for Precision Electronics Inspection Minimum Single-Point Repeatability
With 0.02–0.025 mm XY resolution, the system delivers detailed 3D data for measuring subtle height variations along curved housing parting lines.
0.0005-0.0009 mm Regional Repeatability
Using the PCB substrate as a reference plane, the system captures component tops and surrounding structures to support height, tilt, and flatness measurements.
2448×2048（5.0 MP） High-Resolution Imaging
With a 45 × 37 mm field of view at 265 mm, the system captures miniature connector contacts precisely, including fine edge, position, and structural details.
0.8s Per Fram Fast 3D Acquisition
Captures pin tops, reference surfaces, and spatial height data within automated production cycles to support coplanarity and tilt inspection.
