5 MP High-Resolution Imaging
With 0.065–0.073 mm XY resolution, the system captures fine features such as mid-frame holes, slots, step features, and local edges.
Precision Smartphone Mid-Frame Inspection
Dense holes, slots, and steps, combined with strong intensity variations on highly reflective metal surfaces, make it difficult for 2D imaging to measure local height differences reliably.
3D Adhesive Bead Inspection
Similar adhesive and substrate colors make missing adhesive, bead deviation, discontinuities, and height variations difficult to detect with 2D imaging alone.
Small Holes on Highly Reflective Surfaces
Small, densely spaced holes with black cavities and highly reflective surfaces make hole-edge and center-position extraction challenging and less reliable with 2D imaging.
Local PCBA Feature Inspection
Dense component layouts with subtle height variations make it difficult for 2D inspection to assess hole positions, local warpage, and assembly geometry simultaneously.
Product Features
2D + 3D Single-Shot Acquisition
2D imaging identifies adhesive bead position and edges, while 3D data captures height and surface profiles. HDR improves data integrity across surfaces with complex intensity variations.
0.0069-0.0103 mm Single-Point Repeatability
Provides reliable 3D data for small-hole center localization, hole-to-hole spacing, and the spatial relationship between features and surrounding reference surfaces.
0.0005-0.0011 mm Regional Repeatability
Enables consistent comparison of local height, surface topography, and assembly-state variations across PCBAs and precision components.
